Huawei may borrow a page out of Apple and Intel's CPU playbook — next-gen Kirin CPU may use similar packaging as Apple M-series chips and Intel Lunar Lake

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Huawei's next-generation Kirin chip will reportedly use a unified memory architecture (UMA), much like the Apple M-series silicon and Intel Core Ultra Series CPUs. It means that Huawei will bake in the RAM on the next-generation Kirin processors and make it available to the GPU and CPU. Weibo user Fixed Focus Digital (machine translated from Chinese), who also predicted that the Kirin CPU with Taishan V130 cores could match Apple M3 performance, said, "This is a chip specially planned for AI terminal products, and the memory bandwidth is double that of previous PC chips."

Huawei used to be one of the leading smartphone manufacturers in the world until the U.S. government slapped it with bans and sanctions because of its relationship with Beijing. The company was slowly building up its silicon at that time. Still, because it no longer had access to Qualcomm's and Intel's latest chips or the advanced chip production facilities at TSMC, Huawei was forced to focus on hardware research to build its processors.

By Jowi Morales.

Full story at Yahoo News.